3M Electrically Conductive Tapes
3M Electrically Conductive Tapes feature XYZ-axis or Z-axis conductivity in various conductive adhesives, carriers, and conductive fillers. The tapes provide enhanced EMI performance in workability, conformability, adhesion, temperature durability, and other metrics. 3M peel-and-stick solutions offer reliable performance across frequency bands for a wide range of applications. 3M EMI shielding and grounding solutions minimize EMI noise and crosstalk, increase signal-to-noise ratio (SNR), and meet electromagnetic compatibility requirements. The 3M Electrically Conductive Tapes are available in various thicknesses, adhesion-level, conformability, and flexibility to meet design specifications.
Features
- XYZ-axis or Z-axis conductivity
- Improved electrical resistance for small contact areas
- High adhesion for reliable contact to various substances
- Easy handling and workability
- Good EMI shielding in bond line gap
- Multiple levels of adhesion, conformability, and flexibility
- Broad range of tape thickness for different gap sizes
Applications
- EMI shielding and grounding
- Shielding display wrap
- Flex circuit to flex circuit interconnection
- Shield can lids
- Sensor grounding
- Display chip on flex and PCB/flex/chassis grounding
- Electrostatic Discharge (ESD)
- EMI shield and gasket attachments
- FPC grounding
- Bond line gap shielding
- PIM management
Specifications
- 1020BC
- 0.015Ω electrical resistance through adhesive
- 0.1Ω surface resistance of black foil
- 1050TC
- 0.015Ω electrical resistance through adhesive
- 3304BC-S
- 45µm thickness
- 1300gf/in adhesion to SUS
- 0.1Ω XY-axis resistance of the backing
- 0.05Ω electrical resistance through adhesive
- 5113DFT
- 0.03Ω electrical resistance through Z-axis
- 0.07Ω electrical resistance through XY-axis
- 5113SFT
- 0.07Ω electrical resistance through XY-axis
- 50μm thickness
- 9772
- 0.015Ω electrical resistance through adhesive (FS and BS side)
Videos
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